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Packaging is the final step in the process for manufacturing a semiconductor device. A critical tool for packing is the die bonder, which facilitates device assembly typically by attaching a chip in a...
西安电子科技大学集成电路测试技术课件第4章 模拟 simulation
Motivated by the design of an integrated CMOS-based detection platform, a simulation model for CCD and CMOS imager-based luminescence detection systems is developed. The model comprises four parts. Th...
This paper is concentrated on the development of a complete complementary silicon MESFET technology. The basic difference between MOS and MES are pointed out and design criteria for CMES inverters usi...
The use of VDMOS transistor under certain functional stress conditions produces a modification of its physical and electrical properties. This paper explores the physical analysis and SPICE simulation...
The simulation principles of monolithic microwave dynamic transistor negatrons (circuits with negative differential active resistance) are introduced. The non-linear model has been developed on the ba...

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