搜索结果: 1-10 共查到“电子科学与技术 multilayer”相关记录10条 . 查询时间(0.078 秒)
Electromagnetic radiation from multilayer printed circuit boards: a 3D FDTD-based virtual emission predictor
Electromagnetic Compatibility EMC EM Emission Printed Board
2010/1/11
A novel FDTD-based virtual electromagnetic compatibility tool for the prediction of electromagnetic emissions from a multilayer printed circuit board is introduced. Tests are performed with characteri...
Transmission Function of Cascaded Multilayer Medium Thin Film Filter
Integrated optics device optical amplifiers optical waveguide amplifier
2010/7/16
A cascaded multilayer medium thin film filter used for flattening the gain of erbium-ytterbium co-doped waveguide amplifier(EYCDWA) is presented. The transmission function of cascaded multilayer mediu...
A Low-Pass Filter of Wide Stopband with a Novel Multilayer Fractal Photonic Bandgap Structure
Photonic Bandgap Fractal Low-Pass Filter
2010/12/7
A novel, multilayer fractal PBG is presented here as the substrate for a microstrip line and the resulting configuration builds a low-pass filter of wide stopband. Experimental results in comparison w...
Computation of Conductance and Capacitance for IC Interconnects on a General Lossy Multilayer Substrate
Interconnect transmission lines Admittance per unit length Galerkin procedure Lossy multilayer medium
2010/12/8
In this paper a simple method for analysis and modelling of transmission interconnect lines on general lossy multilayer substrates at high bit rates is presented. The analysis is based on semi-analyti...
Fabrication and Characterization of Multilayer Capacitors Buried in a Low Temperature Co-Fired Ceramic Substrate
Capacitor embedded low temperature co-fired ceramic
2010/12/10
Multilayer ceramic capacitors designed to be embedded in a low temperature co-fired ceramic substrate have been successfully fabricated. Low and high value capacitors were respectively embedded in the...
Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards
Sims and Auger Test Methods Multilayer Printed Circuit Boards
2010/12/23
The quality and reliability of multilayer boards are determined by the adhesion strength between the copper sheets and the epoxy-glass laminates. The adhesion properties of copper foil may be improved...
Mid-Film Interconnects for Multilayer Microcircuit Packages
Mid-Film Multilayer Microcircuit Packages thin film technology
2010/12/23
The mid-filmR process has been developed to combine the photolithographic capability of thin film technology and the low cost, non-vacuum processing of thick film technology. In this paper, we present...
Wire Laying Methods as an Alternative to Multilayer PCB's
Wire Laying Methods Multilayer PCB's
2010/12/23
The rapid growth of integrated circuit technology, culminating in VLSI circuits, is responsible for the proliferation of new, surface mountable device packages with large numbers of input-output termi...
Improvements in Multilayer Ceramic Capacitors
Multilayer Ceramic Capacitors chip encapsulated formats decoupling Integrated Circuit
2010/12/23
The increased use of Multilayer Ceramic Capacitors in both chip and encapsulated formats is mainly due to their excellence at decoupling Integrated Circuit Random Access Memories.
As a result of this...
Failure Mechanisms That Cause High Electrical Leakage in Multilayer Ceramic Capacitors
Failure Mechanisms High Electrical Leakage Multilayer Ceramic Capacitors
2010/12/28
The causes of failure mechanisms of multilayer ceramic capacitors that result in zero resistance (shorts) or low resistance (high leakage) behaviour in the capacitors when the capacitors are subjected...