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西安电子科技大学微电子封装技术课件 先进封装技术（TAB+3D+WLP）。
Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
GANG Bonding Gold-Plated TAB Outer Leads
2011/1/5
This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for...