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Thermal Placement in Hybrid Circuits—A Heuristic Approach
Thermal Placement Hybrid Circuits A Heuristic Approach
2010/12/15
This paper deals with the placement of heat dissipating components in hybrid circuits. An optimum placement is found when the extreme temperatures on the substrate are minimized. Whereas classical tec...
Computer Aided Design of Hybrid Circuits
Computer Aided Design Hybrid Circuits software modules
2010/12/27
A system (hardware/software) has been implemented which makes it possible, taking advantage of existing programs with the addition of suitable interfaces and appropriate software modules, to automate ...
This paper describes the critical factors required for the solder paste process and its applications to Hybrid Circuits (Solder Paste Process). It also describes the fine solder printing of substrate ...
A New Approach to the Topological Design of Hybrid Circuits
the Topological Design Hybrid Circuits
2011/1/21
A computer-aided topological hybrid layout-design procedure is proposed, that yields the wanted principal routing in the form of a geometrical planarization graph. A so-called grid-embedding of a circ...
The quality and reliability of hybrid circuits is examined, with particular reference to the BS9000/CECC systems. It is shown that the capability approval approach developed within the BS9000/CECC sys...
The Solution of Two-Dimensional Heat Conduction Problems for Predicting Operating Temperature and Power Handling Capabilities of Hybrid Circuits
Two-Dimensional Heat Conduction Problems Temperature and Power Hybrid Circuits
2011/1/21
The problems of heat conduction in hybrid thin and thick film circuits have been investigated using both analytical and numerical approaches.The calculations were restricted to two dimensions by assum...