搜索结果: 1-6 共查到“林业工程 Adhesives”相关记录6条 . 查询时间(0.045 秒)
Efficient utilization of peach gum to prepare UV-responsive peelable pressure-sensitive adhesives for non-destructive fabrication of ultrathin electronics
Peach gum LiCl DMAc Sorbitol Polyurethane acrylate Peelable PSAs
2023/11/16
Restricted by the poor solubility and complex structure, it remains a significant challenge to efficiently convert raw peach gum (RPG), a natural plant gum comprised of polysaccharides, into usable po...
New Binary Blends of Ethylene-co-n-butyl Acrylate (EBA) Copolymer and Low Molecular Weight Rosin Ester Resin with Potential as Pressure Sensitive Adhesives
ethylene-co-n-butyl acrylate copolymer glycerol rosin ester pressure sensitive adhesive compatibility tack adhesion
2024/3/12
For improving the adhesion property of ethylene-co-n-butyl acrylate copolymer (EBA) at ambient temperature, binary blends of EBA with 27 wt% n-butyl acrylate and different amounts (20–62 wt%) of low m...
Inventory Analysis of Adhesives Used for Wood Based Materials
inventory analysis formaldehyde resin phenol resin resorcinol resin
2009/3/6
Five popular adhesives of urea resin (UF), melamine-urea cocondensed resin (MUF), phenol resin (PF), phenol-resorcinol resin (PRF), and aqueous polymer isocyanate (API) for wood based materials were a...
Effect of isocyanate adhesives（EMDI）on physical properties and blisters
MDI structural panel wood from thinnings construction waste wood blister
2009/3/6
A strand-particle board (SPB) was manufactured using unoriented strands for the surface layers and unoriented particles for the core layer. Todomatsu (Abies sachalinensis) strands, recycled waste woo...
Studies on Lignin-Based Adhesives for Particleboard Panels
Organosolv lignin lignin-phenol-formaldehyde resin methylolation tensile strength physical properties particleboard
2009/1/13
The ultimate aim of this work was to develop a phenolic resin for partially replacing phenol with modified organosolv lignin in phenol-formaldehyde (PF) resin production. The lignin-formaldehyde relat...