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Just as the single-crystal silicon wafer forever changed the nature of communication 60 years ago, a group of Cornell researchers is hoping its work with quantum dot solids – crystals made out of crys...
Numerical study on thermal stress cutting of silicon wafer using two-point pulsed laser
brittle materials thermal stress laser cutting
2011/5/5
Laser cutting using the controlled fracture technique has great potential to be used for the separation
of brittle materials. In this technique, thermal stress is used to induce the crack and the mat...
硅片边缘超声振动辅助化学机械抛光实验（Experiment on Silicon Wafer Edge Hybrid Polishing of Ultrasonic Vibration and Chemical Mechanical）
硅片边缘 超声椭圆振动 复合抛光
2010/2/26
提出一种超声振动辅助化学机械复合抛光硅片边缘新技术，建立了抛光工具设计、性能检测及复合抛光实验系统，并进行了不同超声振动形式传统化学机械以及抛光工具对硅片边缘抛光的实验研究。结果表明，在相同抛光条件下，抛光工具超声椭圆振动对抛光效果的改善作用最佳。抛光工具加入超声椭圆运动后，工件表面粗糙度值Ra由传统抛光法的0.059μm降低到0.043μm，材料去除量增加22%，且抛光表面形貌有明显改善。 A ...
In 2006, around 86% of all wafer-based silicon solar cells were produced using screen printing to form the silver front and aluminium rear contacts and chemical vapour deposition to grow silicon nitri...