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搜索结果: 1-11 共查到工学 adhesives相关记录11条 . 查询时间(0.049 秒)
Restricted by the poor solubility and complex structure, it remains a significant challenge to efficiently convert raw peach gum (RPG), a natural plant gum comprised of polysaccharides, into usable po...
One particularly important job that plastics perform every day is to make things adhere to a variety of surfaces -- like the way sticky parts work on Post-it notes, Scotch tape, or even Band-Aids. A t...
For improving the adhesion property of ethylene-co-n-butyl acrylate copolymer (EBA) at ambient temperature, binary blends of EBA with 27 wt% n-butyl acrylate and different amounts (20–62 wt%) of low m...
Degradation processes act on adhesive bonds behaviour in a negative way. The aim of experiments is to set the influence of liquid contaminants on strength changes of the adhesive bonds created with th...
Degradation processes act on adhesive bonds behaviour in a negative way. The aim of experiments is to set the influence of liquid contaminants on strength changes of the adhesive bonds created with th...
Wood Adhesives and Adhesion     Wood  Adhesives  Adhesion       2009/3/6
Wood Adhesives and Adhesion.
Five popular adhesives of urea resin (UF), melamine-urea cocondensed resin (MUF), phenol resin (PF), phenol-resorcinol resin (PRF), and aqueous polymer isocyanate (API) for wood based materials were a...
A strand-particle board (SPB) was manufactured using unoriented strands for the surface layers and unoriented particles for the core layer. Todomatsu (Abies sachalinensis) strands, recycled waste woo...
The ultimate aim of this work was to develop a phenolic resin for partially replacing phenol with modified organosolv lignin in phenol-formaldehyde (PF) resin production. The lignin-formaldehyde relat...
With the dramatic growth in electronic circuitry applications, more demands are being placed on those systems’ integrity and reliability. More circuits require use of higher frequencies and smaller s...
The results of a study of the application of conductive adhesives for attaching semiconductor chips to thin film Au conductors is presented. The study concentrates on measuring the stability of the el...

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